Micro-cable interconnect
US5052105A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 1990 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Jun 5, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A micro-cable interconnect comprises a single exterior flexible insulative coating internally containing a plurality of terminally prepared, precisely spaced conductors. The conductors are arranged with a spacing and pitch to identically match spacing and pitch of interconnect zones operatively connected to an integrated circuit or connector, with the conductors constructed and arranged for bonding to the interconnect zones. A method of forming a micro-cable interconnect comprises the steps of: PA0 (a) providing a continuous formation of conductors of precisely controlled spacing and tension to identically match spacing of interconnect zones operatively connected to an integrated circuit or connector to which the conductors are constructed and arranged for attachment; PA0 (b) applying coating precursor to selected lengths of the formation of conductors and providing curing to the selected lengths to provide cured and uncured portions; and PA0 (c) cutting the conductors at the uncured portions to form micro-cable interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.