LSI temperature control system
US5052472A · kind A · utility
64Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1989 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Jul 19, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/70
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An LSI temperature controlling system has closed LSI cooling water circuit, and a refrigeration circuit including a motor-driven refrigerant compressor, a first heat exchanger for exchanging the heat of the LSI cooling water and the refrigerant and a second heat exchanger for exchanging the heats of the refrigerant and another fluid. The motor speed is controlled by an inverter the operation of which is controlled based on the temperature of the LSI cooling water measured by a temperature detector. A heater is used to suppress dew formation on LSI substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.