Heat-recoverable soldering device
US5052610A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1990 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Aug 9, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/48
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Heat recoverable soldering devices comprising a heat recoverable tubular article having at least one open end, and containing a solder insert, is provided with a curable adhesive insert between the solder insert and the open end. The curable adhesive melts, flows and cures when heat is applied to recover the article. The adhesive cures such that its viscosity increases to a value of at least 1.5 its initial viscosity during recovery of the article. Curing of the adhesive inhibits flow of the adhesive through the open end of the article and/or into the solder connection formed between two (or more) elongate bodies inserted into the article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.