Junction inspection method and apparatus for electronic parts
US5052816A · kind A · utility
39Cited by
6References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 1989 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Aug 29, 2009 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/72
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A plurality of lead wires such as those from an IC (an integrated circuit) is irradiated by a fan beam at same time. Infrared rays radiated from the portion which is irradiated by the fan beam and the periphery of the portion are detected so as to catch a thermogram exhibiting the temperature distribution. The thermogram is processed by image processing so as to produce a temperature distribution image. This image is visually compared with a standard temperature distribution-pattern on a display apparatus to judge whether soldering on those lead wires is defective or not.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.