Cut and score die apparatus and method
US5052992A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 6, 1990 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Feb 6, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB31B2160/10
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A cut and score die apparatus is provided for progressively converting a sheet of material into blanks. The apparatus includes a punching section for punching scrap material from the sheet of material to define an array of interconnected blanks arranged in a grid of rows and columns on the sheet of material. A scoring section is provided for simultaneously scoring a first predetermined pattern on a trailing portion of a first row of blanks and a second predetermined pattern on the leading portion of a second, succeeding row of blanks on the sheet of material. A blanking section is also provided for piercing the sheet of material in a predetermined pattern to cut blanks from the sheet of material without producing any additional scrap material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.