Selective laser sintering with assisted powder handling
US5053090A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 1990 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Jul 2, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method and apparatus for selectively sintering a layer of powder to produce a part comprising a plurality of sintered layers. The apparatus includes a computer controlling a laser to direct the laser energy onto the powder to produce a sintered mass. The computer either determines or is programmed with the boundaries of the desired cross-sectional regions of the part. For each cross-section, the aim of the laser beam is scanned over a layer of powder and the beam is switched on to sinter only the powder within the boundaries of the cross-section. Powder is applied and successive layers sintered until a completed part is formed. Preferably, the powder is deposited to the target area of the laser and attains high bulk density during sintering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.