Film bonding method and apparatus for performing same
US5053099A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 1990 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Jan 2, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1741
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The apparatus for bonding a film, having a length corresponding to the length of a board, to a film bonding surface of the board by compression bonding rollers which comprises a conveying device for conveying the board, a board clamp and guide device for clamping and guiding said board at a predetermined position, a film feed member for holding the leading end of the film by suction and feeding the leading end of the film to a film bonding position, a film leading end-holding member provided in the vicinity of the film bonding position, and having a holding surface for face-to-face contact with the leading end of the film fed by the film feed member to the film bonding position, the film leading end-holding member having film suction apertures connected to a vacuum system so as to cause the leading end of the film to be held on the holding surface by suction, compression bonding rollers for bonding the film, held at the film bonding position by the film feed member, from its leading toward trailing end to the film bonding surface of the board from the leading end to trailing end of the board, and a cutting device for cutting the continuous film at its trailing side into a length co…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.