Process for depositing silicon oxide on a substrate
US5053244A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 19, 1988 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Feb 19, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/46
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention relates to an apparatus for producing a plasma and treating substrates therein. The plasma produced by means of microwaves serves to coat a substrate which is situated in a chamber (5) having metal walls (6,7,12,13). The microwaves are repeatedly reflected at the metal walls (6,7,12,13), so that the chamber (5) has numerous microwave modes. By means of permanent magnets, which are placed either inside the chamber (5) or outside the chamber (5) in the vicinity of the substrate that is to be coated, it is possible to produce within this chamber (5) an electron-cyclotron resonance which permits a locally controlled ignition of the plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.