Thermoplastic molding materials

US5053458A · kind A · utility

Assignee

• BASF SE

Inventors

• Christof Taubitz · Monsheim, DE
• Erhard Seiler · Ludwigshafen, DE
• Klaus Boehlke
• Klaus Bronstert · Eisenberg (Pfalz), DE
• Daniel Wagner · Bad Dürkheim, DE

Key dates

• Filing date: Apr 5, 1990
• Grant date: Oct 1, 1991
• Expiry date: Apr 5, 2010

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S525/905
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain, as essential components, PA0 A) from 5 to 94% by weight of a polyamide, PA0 B) from 5 to 94% by weight of a polyphenylene ether, PA0 C) from 1 to 20% by weight of a partially hydrogenated PQP' block copolymer, where PA1 .alpha.) the blocks P and P' consist of vinylaromatic monomers and the total amount of these blocks in the block copolymer is from 25 to 40% by weight, PA1 .beta.) the number average molecular weight of block P is not more than 8,000 and is smaller than the number average molecular weight of block P', PA1 .gamma.) block Q consists of conjugated diene monomers and accounts in total for from 60 to 75% by weight of the block copolymer and PA1 .delta.) from 5 to 30% by weight of the double bonds in block Q are not hydrogenated, and PA0 D) from 0 to 50% by weight of a vinylaromatic polymer.