Novel imido polymers
US5053474A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 1989 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Oct 26, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0346
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel thermally stable imido polymers, whether in prepolymeric or cured state, well adapted for the production of prepregs and other useful shaped articles, include the copolymerizates of: PA1 (a) at least one maleic N,N'-bisimide; PA1 (b) at least one hindered diprimary diamine of the 4,4'-diamino-3,3',5,5'-tetraalkyldiphenylmethane or 1,3-or 1,4-diaminotrialkylbenzene type; PA1 (c) optionally, at least one comonomer other than a bisimide and containing one or more polymerizable carbon-carbon double bonds; PA1 (d) optionally, an imidazole compound; and PA1 (e) at least one chlorinated or brominated epoxy resin, N,N'-alkylenebistetrahalophthalimide and/or a compound containing two phenyl radicals bonded directly together via a single valence bond, a divalent radical or a bridging atom, in which each phenyl radical is substituted by a (meth)allyloxy radical and by at least two chlorine or bromine atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.