Epoxy resin composition
US5053475A · kind A · utility
3Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1990 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Jun 22, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/56
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition characterized by comprising, as essential components, PA0 (A) a bifunctional epoxy resin, PA0 (B) a trifunctional epoxy resin, PA0 (C) a phenol compound represented by the following formula ##STR1## (X.sub.1 to X.sub.8 each represent Br, Cl or H and at least four of X.sub.1 to X.sub.8 each represent Br or Cl; R.sub.1 and R.sub.2 each represent H or CH.sub.3), and PA0 (D) 4,4'-diaminodiphenyl sulfone or 3,3'-diaminodiphenyl sulfone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.