Epoxy resin composition based on bisphenol epoxy, polyetherpolyol, anhydride and imidazole
US5053476A · kind A · utility
7Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1989 |
| Grant date | Oct 1, 1991 |
| Priority date | — |
| Expiry date | Jun 23, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises: PA1 (A) a mixture containing PA2 (a.sub.1) a liquid, Bisphenol-type epoxy resin, and PA2 (a.sub.2) an inorganic filler, PA2 (a.sub.3) a polyether polyol; and PA1 (B) a liquid curing agent including PA2 (b.sub.1) an acid anhydride, and PA2 (b.sub.2) an imidazole compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.