Gripper for the advantageously robotized handling of one or more silicon wafers and/or of a support for such wafers
US5054834A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1989 |
| Grant date | Oct 8, 1991 |
| Priority date | — |
| Expiry date | Dec 5, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S294/907
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gripper for the advantageously robotized handling of one or more silicon wafers (5) comprises a part (2, 102) which allows the gripper (1, 101) to be secured to an operating arm or other handling member (3), the part (2, 102) being rigid with a support structure (4, 104) for the silicon wafers. The structure (4, 104) comprises at least two mutually cooperating opposing jaws (9, 10; 109, 110) mobile relative to each other; the jaws (9, 10; 109, 110) are provided with at least one seat (16, 116) for adapting to the shape of the lateral edge (17) of the wafer (5) supported by the jaws during its handling. Advantageously, on one side (108) of the wafer support structure (104) there are provided at least two members (174) mobile relative to the side (108) and arranged to cooperate with a silicon wafer holder or boat, to enable this latter to be supported and handled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.