Wafer positioning apparatus
US5054991A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 23, 1990 |
| Grant date | Oct 8, 1991 |
| Priority date | — |
| Expiry date | Feb 23, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49131
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The wafer positioning apparatus has an X.multidot.Y axis drive mechanism for moving a mounting stock in the X-axis direction and the Y-axis direction in the X.multidot.Y coordinates on the horizontal plane; a wafer inserting section is fixed on the mounting stock and has a space for inserting a wafer horizontally; photosensors are installed at the wafer inserting section and arranged at regular intervals on positions corresponding to peripheral portions of the wafer so as to detect edge portions of the inserted wafer; and a rotary section is arranged at the center of the wafer inserting section to be attached to the center of the rear surface of the inserted wafer by suction. The wafer is held on a hand plate or the like of a separate carrier system and inserted horizontally into the center of the space within the wafer inserting section, and the photosensors act in this state and detect peripheral portions of the wafer, and at the same time the X.multidot.Y axis drive mechanism acts to move the mounting stock with the wafer inserting section in the X-axis direction and the Y-axis direction in response to detection by photocells so that the center position of the wafer inserting se…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.