Electrodepositable photoresists for manufacture of hybrid circuit boards
US5055164A · kind A · utility
12Cited by
16References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1990 |
| Grant date | Oct 8, 1991 |
| Priority date | — |
| Expiry date | Mar 26, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/135
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed invention relates to a method of manufacturing hybrid circuit boards which uses the step of electrodeposition of a photoresist composition onto said boards. This step represents improvements in the prior art use of dry film or other types of photoresists which did not conform to all three dimensional surfaces and which were not aqueous developable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.