Solder resist composition
US5055378A · kind A · utility
19Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1988 |
| Grant date | Oct 8, 1991 |
| Priority date | — |
| Expiry date | Nov 10, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0783
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A solder resist composition contains a specified partially acrylated and/or methacrylated bisphenol A novolak epoxy resin component, and a specified partially acrylated and/or methacrylated cresol novolak and/or phenol novolak epoxy resin component. The composition further contain a photopolymerization initiator, a thermosetting agent, an inorganic filler, and an organic solvent. The composition may further include a silane or titanate coupling agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.