Method for fabricating an electronic device
US5055816A · kind A · utility
57Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1990 |
| Grant date | Oct 8, 1991 |
| Priority date | — |
| Expiry date | Jun 11, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an electronic device on a carrier (14) is provided wherein the method comprises forming a hole pattern in the carrier (14), and providing a metallization pattern on the carrier, and through the holes (16, 22, etc.) to define the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.