Substrate for an electrical circuit system and a circuit system using that substrate
US5055967A · kind A · utility
44Cited by
6References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 1990 |
| Grant date | Oct 8, 1991 |
| Priority date | — |
| Expiry date | Jul 11, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate is provided for mounting semiconductor devices and comprises an electrically conductive circuit layer, a base layer of an aluminum metal material, and an electrically insulating hard coating dielectric layer of amorphous aluminum oxide which is directly adherent to the base layer for mounting the electrically conductive circuit layer thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.