Headset having reduced width nested bands which are grasped by earcup supporting block
US5056161A · kind A · utility
65Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 26, 1989 |
| Grant date | Oct 15, 1991 |
| Priority date | — |
| Expiry date | Sep 26, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R5/0335
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low spring rate headset has at least one earcup with bands of approximately equal width nested together. An earcup is attached to at least one of the bands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.