Temperature compensation type infrared sensor
US5056929A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1991 |
| Grant date | Oct 15, 1991 |
| Priority date | — |
| Expiry date | Jan 30, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature compensation type infrared sensor includes a substrate having a central pit and functioning as a heat sink with an insulation film formed on the top face of the substrate and defining a diaphragm located above the pit, a plurality of thermocouples disposed on the insulation film and connected in series with each of said thermocouples having a hot junction on said diaphragm and a cold junction on the heat sink, and a thermopile element including a black body on the central portion of the diaphragm in the insulation film for absorbing infrared rays with the thermopile element being placed on a thermistor chip for compensating temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.