Multilayer film and laminate for use in producing printed circuit boards
US5057372A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1989 |
| Grant date | Oct 15, 1991 |
| Priority date | — |
| Expiry date | Mar 22, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multilayer film having as one surface layer thereof a support layer containing a thermoplastic resin able to withstand temperatures up to 200 degrees C. without softening and the other surface layer an adhesive layer containing a thermoplastic resin having a melting point ranging from about 100 to 200 degrees C. Optionally, a tie layer may be employed between the support layer and the adhesive layer. The multilayer film is useful as a protective carrier sheet for a cladding metal foil used in the production of printed circuit boards. The carrier sheet provides temporary, peelable surface protection for the cladding metal foil preventing contamination and physical damage to the foil both before and during printed circuit board formation. Adhesion of the carrier sheet to the cladding metal foil, measured using a 180 degree peel test is less than 0.4 pounds/in-width and greater than 0.005 pounds/in-width, and preferably less than 0.1 pounds/in-width and greater than 0.01 pounds/in-width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.