Hot melt adhesive compositions based on polyesters
US5057561A · kind A · utility
16Cited by
11References
16Claims
0Family size
Inventors
Key dates
| Filing date | Jul 21, 1989 |
| Grant date | Oct 15, 1991 |
| Priority date | — |
| Expiry date | Jul 21, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot melt adhesive compositions comprising: PA1 (a) 40%-90% by weight of a copolyester having a melting temperature lower than 150.degree. C., obtained from an aromatic dicarboxylic acid, an aliphatic dicarboxylic acid, and a glycol; PA1 (b) 5%-55% by weight of an elastomer based on a thermoplastic segmented copolyester having a melting temperature of at least 100.degree. C., and containing recurring units deriving from polyetherglycol; and PA1 (c) 5%-55% by weight of a natural or synthetic thermoplastic resin having a Brookfield viscosity, at 180.degree. C., lower than 25,000 cps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.