Electronic device and heat sink assembly
US5057909A · kind A · utility
20Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 28, 1991 |
| Grant date | Oct 15, 1991 |
| Priority date | — |
| Expiry date | Jan 28, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In integrated circuit packaging, chips are bonded to one side of an intermediate wafer that is resiliently mounted at the periphery with the entire other side of the intermediate wafer being maintained in conformal thermal transfer to external heat dissipation free of any solid connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.