Process for producing electric connecting means, in particular interconnection substrates for hybrid circuits
US5059450A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 1990 |
| Grant date | Oct 22, 1991 |
| Priority date | — |
| Expiry date | Mar 16, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/4867
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The process comprises, after deposition of a layer of raw ink on a support having a high thermal dissipation, of the aluminium nitride type, effecting a preliminary drying of this ink at a temperature on the order of 100.degree. C. to 150.degree. C., then a firing comprising: PA1 (a) a temperature rise including a polymer resin eliminating stage, PA1 (b) a sintering plateau at a temperature on the order of 600.degree. C. to 1000.degree. C., and PA1 (c) a timed cooling, wherein the atmosphere of the polymer resin eliminating stage has an oxygen content of between 100 ppm and 5000 ppm, while the oxygen contents of the high temperature sintering atmosphere and of the cooling atmosphere must be lower than about 10 ppm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.