Hot-melt adhesive composition
US5059487A · kind A · utility
8Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 1991 |
| Grant date | Oct 22, 1991 |
| Priority date | — |
| Expiry date | Jan 30, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Disclosed is a hot-melt adhesive composition comprising (a) 20 to 70 parts by weight of a vinyl aromatic compound/conjugated diene copolymer or a hydrogenation product thereof, (b) 30 to 80 parts by weight of an alicyclic hydrocarbon resin tackifier, the total amount of the components (a) and (b) being 100 parts by weight, and (c) 0.3 to 20 parts by weight of a random copolymer of a cyclic olefin and ethylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.