Method of aligning and bonding tab inner leads
US5059559A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1988 |
| Grant date | Oct 22, 1991 |
| Priority date | — |
| Expiry date | Nov 1, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.