Thermoplastic molding materials based on polyphenylene ethers

US5059645A · kind A · utility

Assignee

• BASF SE

Inventors

• Bertram Ostermayer · Bad Dürkheim, DE
• Erhard Seiler · Ludwigshafen, DE
• Daniel Wagner · Bad Dürkheim, DE
• Klaus Bronstert · Eisenberg (Pfalz), DE
• Volker Ladenberger · Schwetzingen, DE

Key dates

• Filing date: May 2, 1990
• Grant date: Oct 22, 1991
• Expiry date: May 2, 2010

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S525/905
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain PA1 a) from 20 to 80 parts by weight of a polyphenylene ether, PA1 b) from 1 to 20 parts by weight of a block copolymer of the general formula A--B--A' consisting of two polyvinylaromatic blocks A and A' and a partially hydrogenated rubber block B, PA1 c) from 0 to 70 parts by weight of a polyvinylaromatic and PA1 d) from 0 to 40 parts by weight of conventional additives, the sum of a) to d) being 100 parts by weight, where PA2 the mean molecular weights of A and A' differ by a factor of from 2 to 20, PA2 the shorter block A has a mean molecular weight of from 2,000 to 4,000 and PA2 the blocks A and A' together account for from 35 to 50% by weight of b).