Self-bonding enamel solution for heat-resistant coatings

US5059660A · kind A · utility

Assignee

• BASF SE

Inventors

• Peter Hoessel · Schifferstadt, DE
• Hans Schupp · Worms, DE
• Klaus-Wilhelm Lienert · Hamburg, DE
• Helmut Lehmann · Bad Nauheim, DE

Key dates

• Filing date: May 9, 1990
• Grant date: Oct 22, 1991
• Expiry date: May 9, 2010

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01B3/305
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Self-bonding enamel solutions contain PA0 A) from 5 to 80% by weight of a copolyamide composed of units which are derived from PA0 A.sub.1) organic dicarboxylic acids ##STR1## where R.sup.1 is an aliphatic radical of 1 to 20 carbon atoms or an aromatic radical of 5 to 25 carbon atoms, and PA0 A.sub.2) a mixture of diisocyanates, consisting of PA0 a.sub.21) from 20 to 95 mol % of a diisocyanate of the general formula EQU OCN--R.sup.2 --NCO PA0 where R.sup.2 is an aromatic radical of 5 to 25 carbon atoms, PA0 a.sub.22) from 5 to 70 mol % of a diisocyanate of the general formula EQU OCN--R.sup.3 --NCO PA0 where R.sup.3 is ##STR2## or a linear aliphatic radical of 3 to 30 carbon atoms which is substituted by 1 to 3 C.sub.1 -C.sub.4 -alkyl groups and R.sup.4 and R.sup.5 independently of one another are each C.sub.1 -C.sub.4 -alkyl or hydrogen, and PA0 a.sub.23) from 0 to 20 mol % of a diisocyanate of the general formula EQU OCN--(CH.sub.2).sub.y --NCO PA0 where y is an integer of from 1 to 20, and PA0 B) from <0.5 to 30% by weight of a blocked di- or polyisocyanate in an organic solvent or solvent mixture.