Patent · US Expired

Heat-curable bismaleimide resins

US5059665A · kind A · utility

2Cited by

5References

4Claims

0Family size

Assignee

BASF SE

Inventors

Philipp Eisenbarth · Bad Dürkheim, DE
Roland Peter · Mutterstadt, DE
Thomas Folda · Collierville, US

Key dates

Filing date	Aug 15, 1990
Grant date	Oct 22, 1991
Priority date	—
Expiry date	Aug 15, 2010

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08J2379/08
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Heat-curable bismaleimide resins containing an aromatic alkenyl compound, preferably o,o'-diallylbisphenol A, and a Lewis acid as an additive for prolonging the pot life at elevated temperatures are suitable for impregnating reinforcing fibers, rovings so impregnated having a prolonged gel time and being usable for fabrication of wound structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.