Tape of connections for assembly-line mounting of surface-mounted components
US5060117A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 1989 |
| Grant date | Oct 22, 1991 |
| Priority date | — |
| Expiry date | Dec 21, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure concerns a metallic tape that has been previously cut out and is designed for the mounting of surface-mounted components (SMC), using chips having two metallizations on two opposite faces. Each component position, demarcated by two transversal slots, comprises two external connections, each extended by a contact element. This contact element is characterized by a curved shape, formed by a surface to be soldered and a tongue so that, after folding, to create a space for the component, the surfaces to be soldered overlap partially, forming a clip for the component. The disclosure is applicable to the fabrication of SMC components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.