Resist ink composition
US5061744A · kind A · utility
12Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 5, 1989 |
| Grant date | Oct 29, 1991 |
| Priority date | — |
| Expiry date | Jul 5, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1173
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resist ink composition suitable for forming a masking pattern resistive against chemical attack by a chemical plating liquor is disclosed which comprises: PA0 a phenol novolak epoxy resin having an epoxy equivalent of 170-250; PA0 a phenol novolak resin having a softening point of 60.degree.-130.degree. C.; PA0 a montmorillonite organic complex such as bentonite ion-exchanged with an organic cation; PA0 a curing-accelerating catalyst; and PA0 an organic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.