Antistatic, thermoplastic moulding compounds based on aromatic vinyl polymers II
US5061752A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1989 |
| Grant date | Oct 29, 1991 |
| Priority date | — |
| Expiry date | Jun 29, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L71/12
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic moulding compositions composed of PA0 I) 99.8-95% by weight of PA1 (A) 0-100% by weight of one or more graft polymers comprise the monomers styrene, .alpha.-methyl styrene, methyl methacrylate or a mixture of 95-50% by weight of styrene, .alpha.-methyl styrene, ring substituted styrene, methyl methacrylate or mixtures thereof with 5-50% by weight of methacrylonitrile, acrylonitrile, maleric acid anhydride, N-substituted malerimides or mixtures thereof, grafted onto a rubber substrate, and PA1 B) 100 to 0%, by weight of one or more thermoplastic vinyl polymers, and PA0 II) 0.2 to 5% by weight of a polyalkylene ether modified by a radical former which can be compounds conventionally used as an initiator for radical polymerization such as peroxides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.