Patent · US Expired

Antistatic, thermoplastic moulding compounds based on aromatic vinyl polymers II

US5061752A · kind A · utility

14Cited by
2References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 29, 1989
Grant dateOct 29, 1991
Priority date
Expiry dateJun 29, 2009

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L71/12
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Thermoplastic moulding compositions composed of PA0 I) 99.8-95% by weight of PA1 (A) 0-100% by weight of one or more graft polymers comprise the monomers styrene, .alpha.-methyl styrene, methyl methacrylate or a mixture of 95-50% by weight of styrene, .alpha.-methyl styrene, ring substituted styrene, methyl methacrylate or mixtures thereof with 5-50% by weight of methacrylonitrile, acrylonitrile, maleric acid anhydride, N-substituted malerimides or mixtures thereof, grafted onto a rubber substrate, and PA1 B) 100 to 0%, by weight of one or more thermoplastic vinyl polymers, and PA0 II) 0.2 to 5% by weight of a polyalkylene ether modified by a radical former which can be compounds conventionally used as an initiator for radical polymerization such as peroxides.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.