Metallic inks for co-sintering process
US5062891A · kind A · utility
17Cited by
5References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1987 |
| Grant date | Nov 5, 1991 |
| Priority date | — |
| Expiry date | Aug 13, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Metallization, applied by the thick film screening technique, utilized herein has glass-ceramic bonding agents designed to promote adhesion yet maintain the desired electrical properties and post-processing characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.