Patent · US Expired

Method of producing laminated wafers

US5063068A · kind A · utility

20Cited by
8References
11Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJun 7, 1990
Grant dateNov 5, 1991
Priority date
Expiry dateJun 7, 2010

Classification

  • Technology area (CPC A)Human Necessities
  • CPC primaryA21D13/45
  • WIPO fieldFood chemistry
  • WIPO sectorChemistry

Abstract

Laminated bread wafers are produced by fusing at least part of the opposing outer friable crust of two (or more) sheets of bread. Each sheet is composed of outer friable crusts surrounding a center which is soft and porous relative to the crusts. Specifically, one outer crust or a first sheet and one outer crust of a second sheet are moistened by applying droplets of water (e.g. from sprayed water or steam) sufficient to render them fusable. Thereafter, the moistened outer crusts are pressed together to fuse them. Alternatively, an aqueous paste is applied between at least part of an outer crust of the first sheet and at least part of an outer crust of the second sheet, and the sheets are pressed together to fuse them. The resulting laminated bread product comprises multiple layers with a sealed edge, the layers being arranged in the following order: a top friable crust, a porous softer upper core layer, a central fusion layer, a porous softer lower core layer, and a bottom friable crust.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.