Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
US5063121A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 22, 1989 |
| Grant date | Nov 5, 1991 |
| Priority date | — |
| Expiry date | Sep 22, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed is: PA0 i) a nitride type ceramic substrate comprises; a nitride type ceramic sintered sheet; a conductive metallized layer formed on the nitride type ceramic sintered sheet; and a layer of a compound containing yttria and alumina, present in the vicinity of the interface between the nitride type ceramic sintered sheet and the metallized layer; PA0 ii) a circuit substrate comprises; a substrate comprising a nitride type ceramic sintered sheet; a metallized layer comprising molybdenum and tungsten as a main component and an activation metal added thereto formed on the substrate; and a layer of a compound containing yttria and alumina, present inside of the metallized layer and in the vicinty of the interface between the substrate and the metallized layer; PA0 iii) a surface conductive ceramic substrate which is characterized by comprising; a nitride type ceramic substrate; and a conductive metallized layer chiefly comprised of at least one of Mo and W, a group IVa active metal element and a fourth period transition metal (except for Ti), formed on the substrate; and PA0 iv) a surface conductive ceramic substrate which is characterized by comprising a nitride type ceramic s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.