Hydrogen silsesquioxane resin fractions and their use as coating materials
US5063267A · kind A · utility
95Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1990 |
| Grant date | Nov 5, 1991 |
| Priority date | — |
| Expiry date | Nov 28, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to hydrogen silsesquioxane resin (H-resin) fractions derived from an extraction process using one or more fluids at, near or above their critical state. These fractions can comprise narrow molecular weight fractions with a dispersity less than about 3.0 or fractions useful for applying coatings on substrates. The invention also relates to a method of using these fractions for forming ceramic coatings on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.