Water washable soldering paste
US5064480A · kind A · utility
38Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1989 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Aug 4, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3615
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Improved soldering paste for surface mounting of electronic components comprises a novel fluxing agent selected from formylated polyhydric compounds. The paste enables circuit boards to be washed with water to remove flux residues.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.