No-clean solder paste vehicle
US5064482A · kind A · utility
17Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Nov 8, 2010 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A paste vehicle for use in a metal bearing solder paste composition having a heat-polymerizable binder is provided. This vehicle can be non-aqueous, inorganic salt-free and dispersed in a non-aqueous, organic liquid, and may be incorporated with a flux into a solder paste composition capable of utilizing an average particle size finer than 100 mesh. This paste has excellent anti-slump properties, requires no cleanup to remove residual solder reflow, and permits smaller more controlled joints to be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.