Method of forming and bonding fluff pads
US5064484A · kind A · utility
20Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Aug 2, 2010 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F13/15626
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of forming and bonding fluff pads for diapers and the like wherein both the steps of forming and bonding are performed on the same vacuum drum.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.