Electrical conductor deposition method
US5064685A · kind A · utility
32Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1989 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Aug 23, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/143
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A conductive interconnection (27) on a substrate (11) is made by applying a metal-organic compound (25) to the substrate, exposing the metal-organic compound to laser beam radiation (14) in which the power level has been ramped to some specific level and, thereafter, moving the substrate with respect to the laser beam. The movement of the substrate is at an applied rate of speed such that the temperature within the metal-organic compound impinged by the laser beam is properly ramped with respect to time. This leaves a dependable metal deposition (27) which may be monitored through a viewing system (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.