Patent · US Expired

Polyarylene sulfide molding compounds and their use as an encapsulating compound for active and passive electronic components

US5064895A · kind A · utility

5Cited by

1References

6Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Karl-Heinz Köhler · Aachen, DE
Klaus Reinking · Wermelskirchen, DE
Klaus Kraft · Heidelberg, DE

Key dates

Filing date	Aug 7, 1989
Grant date	Nov 12, 1991
Priority date	—
Expiry date	Aug 7, 2009

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08G75/0209
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

The invention relates to molding compounds of polyarylene sulfides (PAS), preferably polyphenylene sulfides (PPS), which have a low ion content and delayed crystallization and to their use as an encapsulating compound for active and passive electronic components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.