Antistatic, thermoplastic moulding compounds based on aromatic vinyl polymers
US5064899A · kind A · utility
2Cited by
5References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Mar 22, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic moulding compounds composed of PA0 99.8-95% by weight of A) 0-100% by weight of a graft polymer B) 100-0% by weight of a thermoplastic polymer of vinyl monomers and PA0 0.2 to 5% by weight of a polyalkylene ether which has been grafted with a polymer of C.sub.1 -C.sub.6 alkyl acrylates, cycloalkyl acrylates or methacrylates and optionally styrene or .alpha.-methyl styrene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.