Transmission line using fluroplastic as a dielectric
US5065122A · kind A · utility
27Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Sep 4, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer substrate having an integral transmission line structure 300 is disclosed. The transmission line structure 300 is formed by metallizing a fluroplastic substrate on the inner surface 112 and outer surface 114 in order to form a transmission line. The metallized inner surface forms a conductive runner 106, while the outer metallized surface 114 forms a ground plane, with the fluroplastic substrate being the dielectric. The transmission line structure 300 is then encapsulated by two substrate layers (402, 404).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.