Waffle wall-configured conducting structure for chip isolation in millimeter wave monolithic subsystem assemblies
US5065123A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Oct 1, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/552
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A two-dimensional periodic conductive post array structure is used to suppress higher order wave propagation within a large microstrip housing assembly without attentuating the desired TEM mode of propagation. Substantially vertical conductive posts are spaced at appropriate wavelength periods in the X and Y directions on top of and through a microstrip substrate in a so called "waffle-wall" type configuration. The periodic post structure provides high microwave signal isolation by functioning as a band rejection filter both above the microstrip substrate and within the substrate to isolate between nearby active and passive circuit functions located on the microstrip substrate. The desired TEM mode microstrip transmission line is routed through the conductive post matrix to provide the signal, control and DC paths between circuit chips and other active and passive circuit functions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.