Multi-layer circuit board, method of manufacturing the same and application thereof
US5065285A · kind A · utility
11Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1990 |
| Grant date | Nov 12, 1991 |
| Priority date | — |
| Expiry date | Mar 7, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0195
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The dislocation between each layer in a multi-layer circuit board and a process for producing the same and an application of the same is minimized by employing a specific adhesive layer between layers of the circuit board. The adhesive layer is composed of a film of a resin having a melting point higher than a temperature for forming the multi-layer (or laminated layer) circuit board and adhesive having a melting point lower than the temperature for forming the multi-layer circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.