Elimination of film defects due to hydrogen evolution during cathodic electrodeposition
US5066374A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 20, 1990 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Sep 20, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0079
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention is directed to a method for eliminating or reducing pinhole defects in cataphoretically deposited films without interfering with the electrolysis of water needed for electrodeposition. This method comprises decreasing the evolution of hydrogen gas at the cathode by adding a compound to the emulsion. This compound is reduced by the hydrogen produced at the cathode during the electrodeposition. The hydrogen reacts with the this non-gaseous compound rather than becoming hydrogen gas and forming bubbles which lead to pinhole defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.