Dispersion strengthened lead-tin alloy solder
US5066544A · kind A · utility
19Cited by
17References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1990 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Aug 27, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12687
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved dispersion strengthened lead-tin alloy solder is provided in which there is dispersed in the solder up to about 5 vol. percent of small particles, of a metal sulfide or a nickel-tin intermetallic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.