Process for forming polyimide-metal laminates
US5066545A · kind A · utility
8Cited by
6References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 12, 1990 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Jan 12, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Polyimide-metal laminates are formed by etching the surfaces of a polyimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.