Electromagnetic wave shielding composition comprising epoxy resin and copper particles
US5066692A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1990 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Jun 21, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electromagnetic wave shielding circuit and the production method thereof is described, wherein the circuit comprises a base board, an electric circuit formed on the base board, an electrically isolating coating coated over the electric circuit, a layer of coating having copper particles contained therein coated over the electrically isolating coating and hardened by heating, a copper plating layer attached to the surface of the copper particle containing coating for discharging out of the electric circuit an electromagnetic wave current which may be produced in the electric circuit, said copper particle containing coating having contained therein 100% by weight of copper particles and 12%-25% by weight of epoxy resin for a binder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.