Semiconductor device having leads for mounting to a surface of a printed circuit board
US5067007A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Jan 24, 1991 |
| Grant date | Nov 19, 1991 |
| Priority date | — |
| Expiry date | Jan 24, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Attempts have been made to increase the number of pins of packages accompanying the trend toward fabricating integrated circuits highly densely and in smaller sizes. The present invention provides technology for improving reliability in fabricating packages of the surface-mounted type that have increased number of pins. That is, when the packages are mounted on the wiring substrate, the lead pins that receive load from the axial direction exhibit bending strength which is smaller than the junction strength of solder at the junction portions. To achieve this object, the lead pins are made of a material having large resiliency such as a fiber-reinforced material, a transformation pseudo elastic material, an ultra-high tension material, or a heat-resistant ultra-high tension material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.